SELECTRONTECHNOLOGY

SEMICONDUCTORS FOR COMMERCIAL APPLICATIONS

Complexity.
Precisely
integrated.

Chip design, packaging and testing for automotive electronics, consumer electronics and medical devices.

DESIGN PACKAGE MANUFACTURE TEST

INSIDE THE INTEGRATIONSiP
CONCEPTUAL PACKAGE STRUCTUREILLUSTRATIVE · NOT TO SCALE
EXPLORE SELECTRON
ENGINEERED FOR INTEGRATIONHybrid ICChip-on-BoardMulti-Chip ModulesSystem-in-Package

01 / OUR EXPERTISE

Every connection matters.
At every stage.

Connected design, manufacturing and test services for commercial semiconductor products. A technical partner from circuit to completed package.

01 — DESIGN

IC & circuit design

Chip and circuit design services that connect your functional requirements with the realities of system integration.

From requirements to circuit
02 — INTEGRATE

Package design
& manufacturing

Package design and manufacturing services for hybrid circuits, chip-on-board assemblies, multi-chip modules and SiP solutions.

From architecture to assembly
03 — TEST

Test services

Testing services to evaluate devices and modules against agreed electrical and functional requirements.

From implementation to evaluation

02 / INTEGRATION TECHNOLOGIES

More capability.
Within the package.

Different commercial products call for different integration architectures. We develop solutions across hybrid circuits, board-level assembly and multi-chip packaging.

SiPSystem-in-Package

Bring multiple semiconductor dies and supporting components together within a single package. Connect circuit design, package architecture, manufacturing and test around your system requirements.

MULTIPLE FUNCTIONS. ONE INTEGRATED PACKAGE.
MCMMulti-Chip Modules

Integrate multiple semiconductor dies on a common substrate. Consider the electrical connections, package layout and assembly requirements as one connected design challenge.

MULTIPLE DIES. A SHARED SUBSTRATE.
COBChip-on-Board

Mount semiconductor dies directly onto a circuit board. Coordinate circuit layout, die attachment, interconnection and protection for a board-level solution.

DIRECT DIE INTEGRATION AT BOARD LEVEL.
HICHybrid integrated circuits

Combine semiconductor devices and passive components on a common substrate, with the circuit and packaging developed around the needs of your application.

DEVICES AND COMPONENTS, WORKING TOGETHER.
Conceptual close-up of an integrated circuit and its interconnectionsPRECISION IN EVERY CONNECTION

03 / ABOUT SELECTRON

Technical depth.
A commercial focus.

Selectron Technology focuses exclusively on semiconductor solutions for commercial products. We bring chip and circuit design, package design and manufacturing, and testing together for automotive electronics, consumer electronics and medical device manufacturers.

We support OEM procurement and engineering teams with hybrid integrated circuits, chip-on-board assemblies, multi-chip modules and System-in-Package technologies. Component sourcing and technical consulting support the wider procurement process.

Explore our applications

04 / COMMERCIAL APPLICATIONS

Semiconductors for
commercial products.

Our products and services are dedicated exclusively to commercial applications, supporting manufacturers and their engineering and procurement teams.

01 / AUTOMOTIVE

Automotive electronics

Semiconductor solutions for automotive electronic products, with circuit design, packaging and testing aligned to the manufacturer's requirements.

02 / CONSUMER

Consumer electronics

Chip and module solutions for consumer devices, connecting circuit and package design for compact, integrated electronic products.

03 / MEDICAL

Medical devices & equipment

Semiconductor design, packaging and test services for manufacturers developing commercial medical devices and equipment.

A CONNECTED APPROACH

From the first requirement
to the finished module.

01

Define

Understand the application, circuit requirements and integration constraints.

02

Design

Develop the circuit and package architecture as connected parts of the system.

03

Manufacture

Bring the package design into manufacturing and module assembly.

04

Test

Evaluate the completed device against the agreed requirements.

LET'S BUILD YOUR NEXT COMMERCIAL PRODUCT

Your next product.
Our next conversation.

Share your application, integration requirements and target schedule with our team.